Our Products
At Quantum Semiconductor Manufacturing Company and Foundries (QSMC Foundries), we provide a diverse range of semiconductor packaging solutions designed to meet the evolving needs of industries ranging from consumer electronics to automotive and industrial applications. Our products combine precision engineering, advanced materials, and innovative design to deliver unparalleled performance and reliability.
QFN Packages: Compact, Efficient, and Versatile
Our Quad Flat No-Lead (QFN) packages are an excellent solution for applications that demand space efficiency and high performance. Widely used in consumer electronics, automotive designs, industrial applications, and power solutions, QFN packages offer superior thermal and electrical properties while maintaining a compact footprint.
Key Benefits of QFN Packages:
Wettable Flank Plated QFN Packages: Meeting Automotive Industry Standards
For the automotive industry, reliability is non-negotiable. Wettable Flank Plated QFN Packages are specifically designed to meet the stringent requirements of automotive Original Equipment Manufacturers (OEMs), where 100% automatic visual inspection (AVI) is crucial for safety and reliability.
Challenges Addressed by Wettable Flank Process:
By adopting wettable flank QFN packages, QSMC Foundries helps reduce inspection time, improve yield, and lower costs, ultimately ensuring superior performance for safety-critical automotive systems.
BGA Packages: High I/O, High Performance
The Ball Grid Array (BGA) is a preferred choice for devices requiring high input/output (I/O) capability. BGA packages eliminate common issues associated with high lead-count packages, such as lead bending and coplanarity concerns, providing enhanced performance for complex systems.
Advantages of BGA Packages:
At QSMC Foundries, we are building a state-of-the-art facility for the production of Plastic Ball Grid Array (PBGA) and flip-chip BGA packages, ensuring the highest level of precision and performance for our clients’ most demanding applications.
Power Devices: High-Power Solutions for Critical Applications
Power modules are essential for high-power switching applications across a variety of industries. These robust modules integrate multiple high-power components, such as transistors and diodes, into a single unit, providing enhanced power handling, improved reliability, and easier thermal management.
Key Features of Power Modules:
Whether you need solutions for MOSFETs, IGBTs, or SCRs, our automotive-grade power modules are built to deliver outstanding performance in even the most rigorous environments.
At Quantum Semiconductor Manufacturing Company and Foundries (QSMC Foundries), we are committed to delivering high-quality semiconductor packaging solutions that empower the next generation of technology. From compact QFN packages to high-power Silicon Carbide devices, our innovative products drive efficiency, reliability, and performance across industries.
